2005 IRW Poster Session Information

The poster session of the IRW 2005 will showcase three types of posters:

 

1.   Refereed Posters will be selected from submitted abstracts by the beginning of August and the authors notified. A list of the authors and titles will appear below. Check this page for updates.  A display board is automatically reserved for you.  You are invited to submit a four-page (maximum) manuscript of your poster presentation for inclusion in the 2005 IRW Final Report (see Milestones below for due date).  This is a great opportunity for you to share your work with your peers.

 

2.   Open posters provide a forum for all attendees to communicate and discuss their ideas and newest results on technical projects or issues. Please indicate your intention to bring a poster in the space provided on the registration form or/and by sending an e-mail to the Poster Session Chair.  A display board will be reserved for you.  In addition, you are invited to submit a two-page (maximum) manuscript of your poster presentation for inclusion in the 2005 IRW Final Report (see Milestones below for due date).

 

3.   Walk-in Posters are last minute posters. Bring your poster directly to IRW and have the Poster Session Chair assign a display board to you. You are also invited to submit a two-page (maximum) manuscript of your poster presentation for inclusion in the IRW 2005 Final Report (see Milestones below for due date).

 

 

Note: All posters and poster manuscripts must comply with the guidelines below:

 

Poster Preparation:

  • If you are presenting a Refereed or Open poster, a display board will be reserved for you. The display board area is 32" × 40" or 81 cm × 100 cm. Your work should be in landscape format on 8½ × 11" or A4 paper with a maximum of 12 pages.
  • Your poster presentation must be self-explanatory and presented in such a way that other attendees, standing one to two meters from your poster, can clearly read and grasp the significance of your work and its central message in a few minutes.  Those attendees that are particularly interested will speak with you to develop further understanding

 

Mechanics

  • Your text should be 24 points or larger.  Headings should be 44 points or larger.
  • Tables should be used sparingly and kept as simple as possible.  Data are almost always more efficiently displayed graphically.
  • A descriptive title should appear at the bottom of all graphs and tables.
  • The use of color can be extremely effective in both making your poster stand out and in emphasizing your presentation’s most important points.  It is usually best to use just a few colors and is always best to be consistent in their use.
  • It is nearly always helpful to sequentially number your paper’s figures, tables and equations.  It may also be helpful to guide the reader’s eye by sequentially numbering your poster’s text panels.

 

Technical/Scientific Organization

  • It is important that those reading your poster understand the motivation of your work and follow your arguments.  You may (or may choose not to) begin your poster with an outline.  Whether you begin with an outline or not, the following sequence is usually effective:
  • Concisely define the problem you have addressed.  What motivated you to conduct this work?  Why is it important for the reader to learn what you have to say?
  • Provide the readers with a concise review of the most pertinent background literature.  (Put your work in context.)
  • Present the main body of your study, you measurements, your calculations, etc.
  • Summarize your most important findings.
  • State your conclusion(s).
  • Make the appropriate acknowledgements.
  • It may be useful to provide interested readers with a pre-print of your IRW paper.
  • Do not include Logos or names of your employer or university on any of the panels, except for the title chart.

 

Manuscript/Abstract Preparation:

Details for preparation of the abstract for inclusion in the IRW Final Report can be found on the IRW Author Instruction webpage.

                                                                        

Milestones (top)

In the following table, you will find a short list of critical milestones for preparing your 2005 IRW Poster presentation.  In order to complete the job, we need your help in adhering to the deadlines below.

 

DATE

MILESTONES

REMARKS

8/12/05

E-mail Poster Program Chair (Pat Lenahan) accepting or declining invitation to present a refereed poster.

Confirmation needed
(refereed posters only)

9/14/05

Draft Summary of poster due to the Poster Sessions Chair.

Your Mentor will contact you.
(refereed posters only).

10/12/05

Open Posters: reserve poster display board.

Contact Poster Sessions Chair
(open posters only).

10/17/05

Submit final manuscript and signed IEEE Copyright Form

Give to Poster Sessions Chair (Pat Lenahan) at the conference (see  IRW Author Instruction webpage for details).

 

We encourage presentation of your latest ideas and newest results on technical projects or issues by accepting your poster upon your arrival at the workshop (track down the Poster Sessions Chair).  However to facilitate planning, if possible, please indicate your intention to bring a poster in the space provided on the registration form or/and sending an e-mail to the Technical Poster Chair by 10/13/05.

                                                                                                       

Downloads

Poster Presentation in Final Report Example (pdf)

IEEE Copyright Form

Acrobat version of the IEEE Copyright Form

 

Refereed Posters (top)

P1 Testing methodology for lifetime extrapolation of pzt capacitors—E. Bouyssou1,2, S. Bruyère2, G. Guégan2, C. Anceau2, A. Agostini1,2, R. Jérisian1
1Université de Tours—LMP; 2STMicroelectronics

P2 Efficient fWLR inline monitoring of hot carrier reliability by means of one simple, comprehensive parameter—R. Vollertsen, H. Nielen, Infineon Technologies

P3 An investigation on stacked NMOSFET with different poly-gates bias conditions under ESD stress in 0.13µm CMOS tolerant I/O circuit—C.-Y. Huang, G. Chen, United Microelectronics Corp.

P4 Impact of NBTI-driven parameter degradation on lifetime of a 90nm p-MOSFET—R. Wittmann1, H. Puchner2, L. Hinh2, H. Ceric1, A. Gehring3, S. Selberherr1
1Technical University at Wien; 2Cypress Semiconductor; 3AMD Saxony

P5 Hot carrier effect on CMOS class e power amplifiers—E. Xiao, UT Arlington

P6 The novel mechanism of temperature effect in ultra-thin oxide breakdown— J. Shieh, T.-K. Kang, C.-L. Lin, O. Lo, J.-P. Chen, K.C. Su, UMC

P7 Impact of device scaling on deep sub-micron transistor reliability - A study of reliability trends using SRAM—M. White1,2, Z. Gur2, M. Talmor2, B. Huang2,J. Qin2, X. Li2, X. Zhang2, Y. Chen1, D. Nguyen1, J. Bernstein2
1JPL; 2University of Maryland

P8 Matching variation after HCI stress in advanced CMOS technology for analog applications—J. C. Lin1,3, S.Y. Chen2, H.W. Chen2, H.C. Lin2, Z.W. Jhou2, S. Chou1, J. Ko1, T.F. Lei3, H.S. Haung2
1United Microelectronics Corp.; 2National Taipei University of Technology; 3National Chiao Tung University

P9 One time programming device yield study based on anti-fuse gate oxide breakdown on P-type and N-type substrates—N. Mathur, Y. Ahn, I. Kouznetov, F. Jenne, J. Fulford, Cypress Semiconductor Inc.

P10 Length scaling effects on dual damascene copper interconnects electromigration— M.H. Lin, K.P. Chang, K.C. Su, UMC, T. Wang, National Chiao-Tung Univ.

P11 IREM usage in the detection of highly resistive failures on 65 nm products— I. Wan, D. Bockelman, Y. Xuan, S. Chen, Intel

P12 Predictive simulation to improve reliability of a snapback-based NMOS clamp— P. Gaitonde et al., Florida Institute of Technology

P13 An investigation on substrate current and hot carrier degradation at elevated temperatures for nMOSFETs of 0.13 µm technology—J. C. Lin et al., UMC

P14 Determination and characterization of EOS-induced on submicron devices using 2D IR spectral imaging technique—M.F. Bailon, P.F.F. Salinas, J.P.S. Arboleda, J.J.C. Miranda, Intel Tech. Philippines

P15 First steps toward aging simulation of complex analog circuits with behavioural modeling—F. Marc, Y. Danto, Université Bordeaux

P16 Some applications of Vbd and Qbd tests—J.T.C. Chen, T. Dimitrova, D. Dimitrov, Four Dimensions, D.K. Schroder, Arizona State University

P17 Accurate method for determination of interconnect cross section— X. Federspiel, Philips Semiconductors, D. Ney, V. Girault, STMicroelectronics

P18 Resistance instability in Cu-damascene structures during the isothermal electromigration test—M. Impronta1, S. Farris1, A. Ficola2, A. Scorzoni1,2
   1Institute for Microelectronic and Microsystems (CNR-IMM)
   2University of Perugia

Open Posters (top)

To be announced…

 

 

For more details, please contact:

 

IRW Poster Sessions Chair

Patrick M. Lenahan

Dept. ESM

212 EES Bldg

Penn State University

University Park, PA 16802

ph:  (814)  863-4630

fax:  (814)  863-7967

 

IRW Poster Sessions Vice Chair

Jason Campbell

Dept. ESM

212 EES Bldg

Penn State University

University Park, PA 16802

ph:  (814)  863-4630

fax:  (814)  863-7967