Questions
1. How is product reliability determined?
a. Accelerated tests.
b. Field tests.
c. Modeling.
2. What drives lifetime requirements and who determines their adequacy?
a. Customer feedback.
b. Expected product replacement timeframe.
c. Field return data.
d. Process and/or product capability.
3. How are use conditions determined?
a. Instrumented products in the field.
b. Customer surveys.
c. Focus groups.
d. Manufacturer expectations.
4. How are new materials and processes driving burn-in conditions?
a. Shorter times.
b. Lower temperatures.
c. Reduced voltages.
d. Burn-in removal for some applications.
5. What other screening techniques or information are being used to supplement, reduce, or eliminate burn-in?
a. Bin-level statistical analysis (e.g. good die in bad neighborhoods).
b. Advanced IDDq (e.g. delta-IDDq, IDDt, etc.).
c. Parametric outlier detection.
d. Wafer-level burn-in.
e. Wafer Level Reliability.
f. Product maturity.
6. What are the risks and mitigation strategies being employed to reduce or remove burn-in?
a. Targeted applications.
b. Field return monitoring and early reaction.
c. Accelerated testing.
d. HALT/HASS.
e. Rogue/maverick lot detection and containment.
f. Design redundancy and robustness.
7. What are the differences between Foundry, captive fab, and customer expectations for burn-in and other screening techniques?
a. Die sales versus package parts.
b. Known-good die contracts.
c. Ownership of the screening process versus yield and process knowledge.
8. How do low-volume, high-reliability markets deal with commercial reality?
a. High per-part costs for customer screening.
b. Lack of visibility into manufacturing processes.
c. Little ability to influence part suppliers.
d. Outsourcing of reliability screening and testing.
9. How are new defect mechanisms, materials, and designs affecting defect coverage metrics?
a. High-k gate dielectrics.
b. Low-k interlayer dielectrics.
c. Reduced thickness liner materials.
d. Strained gate structures.
e. Reduced pitch wiring.
f. Resistive vias.