DG: Interconnects

Ever decreasing dimensions in microelectronic circuit chips lead to two extremes in electromigration testing

- extremely low test currents for the smallest lines

- extremely high test currents for the largest lines The validity of such a test is limited by external factors e.g. measurement equipment or non electromigration effects inherent to the chosen experiment e.g. Joule heating.

In addition the introduction of low k materials adds concerns due to thermal connectivity and cycling as well as potential corrosion effects.

These are challenges to the traditional approach with Black's equation to determine the interconnect lifetime.

The Interconnect Discussion Group invites attendees to share their concerns and knowledge of the topic. Hopefully as a group we can combine our wisdom to find answers for todays challenges.