JEDEC 14.2 Committee Agenda

THURSDAY, October 18

2:00–3:00 p.m. JEDEC 14.2 Committee on Wafer Level and Technology Reliability

Introductions/agendas/minutes and separation into 3 subcommittee sessions

3:00–6:00 p.m. JEDEC subcommittee sessions:

Device – NBTI spec, Dielectric & Interconnect BEOL TDDB spec

6:00-7:00 p.m. Supper

7:00-10:00 p.m. Subcommittee meeting continuation

or combined discussions on JP001 and/or other topics (e.g. combination of Failure Rates)

FRIDAY, October 19

7:00–8:00 a.m. Breakfast

8:00–10:30 a.m. JEDEC subcommittee sessions continuation

(completion of above topics and/or introduction of next topics)

10:30–11:00 a.m. Break and checkout

11:00–noon. Subcommittee summaries and overall Wrap-up

12:00–1:00 p.m. Lunch and leave camp