IRW 2007 · October 15-18, 2007 Stanford Sierra Conference Center, Fallen Leaf Lake, California
The Integrated Reliability Workshop focuses on ensuring electronic device reliability through fabrication, design, testing,
characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability
problems. Through tutorials, discussion groups, special interest groups, and the informal format of the technical program, a
unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for
present and future semiconductor applications as well as for ample opportunities for discussions and interactions with
colleagues.
Hot reliability topics for the workshop include: high-k and nitrided SiO2 gate dielectrics, transistor reliability including hot
carriers and NBTI/PBTI, Cu interconnects and low-k dielectrics, product reliability and burn-in strategy, impact of transistor
degradation on circuit reliability, reliability modeling and simulation, SiGe and strained Si, III-V, SOI, optoelectronics, single
event upsets, and reliability assessment of novel devices, organic electronics, emerging memory technologies, and future
“nano”-technologies.
Latest travel and accommodations information
Location: Stanford
Sierra Camp, Fallen Leaf Lake, Calif. getting there from
Reno, Nevada: South Tahoe Express driving there from Reno Airport: (directions) in
14 steps weather links and sky cam of
South lake Tahoe
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