IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP
October 18-22, 2009

 

Keynote Address:
Reliability in the More than Moore Landscape

Dr. John Schmitz
VP Process Technology Research
NXP Semiconductors

The semiconductor industry is not only involved in the economical turmoil but has at the same time to deal with some steep technological barriers as well as challenging society demands in the fields of for example health, energy, security and privacy. However, it is exactly these societal trends that bring huge opportunities to the industry. To name a few: power management in hybrid cars, smart power management in homes and buildings, photo-voltaic electricity, secure data transfer, bio-metric data protection, bio electronic diagnostic devices, e-pill and so on.

It is good to notice that in order to bring these products to the mentioned markets there is not always a need to have the latest and greatest advanced CMOS nodes available. Often one can make these products in something like 120nm CMOS technology for example. But what will be predominantly present in these products are large analog blocks as well as new functionality in the mechanical or optical domains. Thus new materials (for sensors for example), opto-electronics and MEMS, whether integrated with the CMOS circuit or not, will start to play more visible roles. In many applications reliability will have quite different requirements than we are used to (for instance reliable performance requirements may vary from a few hours to up to 20 years and at much higher temperatures (lighting, automotive) and in really different environments (human body for instance).

Although we have built up in the last 30 years a vast arsenal of reliability testing techniques, methods and understanding in semiconductors it is not so clear whether this will be 1-1 transferable to these new domains. We may need new insights to deal with these deviating reliability requirements. It is this facet that the presentation will highlight.

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John Schmitz is a VP of Process Technology Research at NXP Semiconductors and oversees research activities in IC and MEMS processes and device technologies for identification, high voltage and power, sensor, automotive, discrete and other applications.

Prior to that, he served as VP and COO for manufacturing technology of SEMATECH from April 2002 to December 2005. There he launched the Advanced Technology Development Facility (ADTF) for-profit subsidiary as well as the International SEMATECH Manufacturing Initiative (ISMI) subsidiary.

Prior to coming to SEMATECH, he served as vice president and general manager of MOS4YOU in the Netherlands, Philips Semiconductors' advanced development and manufacturing unit for embedded nonvolatile memories. Schmitz joined Philips Research Labs in 1984, where he worked on various interconnect systems for advanced integrated circuits. After that he served as a director of process development at Genus Inc. He worked for two years in the joint ST-Philips development center in Crolles, France, in the development and manufacture of planarization techniques and dielectric materials as a group leader. Schmitz holds a master's degree in chemistry from Radboud University of Nijmegen, Netherlands, and a doctorate in physical chemistry from Radboud University Nijmegen.

He has authored more than 45 papers in various scientific journals and has written books on IC technology, titled Chemical Vapor Deposition of Tungsten and Tungsten Silicides for VLSI/ULSI Applications, and on thermodynamics titled The Second Law of Life. He holds six patents in the areas of PECVD-TiSi2 and CVD-W.

He serves on several board and panels such as the Scientific Advisory Board of IMEC and the Editorial Panel of Future Fab.

Text Box: 2009 Keynote