tutorial speaker

Affiliation

 tutorial topic

Hans Reisinger

Infineon,
Germany

NBTI

Jim Lloyd

SUNY Albany,
New York

Latest Developments in
Failure Modeling of
Electromigration and ILD TDDB

Felice Crupi

Univ. Calabria, Italy

Reliability and variability of FinFETs

Norbert Seifert

Intel,
USA

Radiation-induced Soft Errors: Status Quo and Key Challenges

Michael Dammann

IAF Fraunhofer,
Germany

Reliability of III-V
Semiconductors/GaN

Joe McPherson

Consultant,
TI Fellow Emeritus,
USA

TDDB Physics: Transitioning From Silica to High-k Gate Dielectrics

Alain Bravaix

ISEN, France

Hot carriers