IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP
held October 17-21, 2010

 

Keynote Address:
Life beyond Si: More Moore or More than Moore?

Raj Jammy

Vice President of
Materials and
Emerging Technology

SEMATECH

Raj Jammy is Vice President of Materials and Emerging Technologies at SEMATECH.  Previously on assignment from IBM, Jammy has joined the SEMATECH staff and will continue to direct SEMATECH's Front End Processes division as well as lead efforts to tap into emerging technologies with disruptive scaling potential.

Jammy holds a doctoral degree in Electrical Engineering from Northwestern University. Upon graduation, he joined IBM’s Semiconductor Research and Development Center in East Fishkill, NY, where he worked on front-end technologies for deep-trench DRAMs.   He subsequently became Manager of the Thermal Processes and Surface Preparation group in the DRAM development organization. In 2002, Dr. Jammy moved to T. J. Watson Research Center in Yorktown Heights, NY to manage IBM’s efforts in high-k gate dielectrics and metal gates. In 2005, he accepted assignment to SEMATECH as Director of the Front End Processes Division. He holds more than 50 patents and is an author/co-author of over 150 publications/presentations.

Text Box: 2010 Keynote

As the semiconductor industry accelerates on a collision course with physical and electrical roadblocks on the scaling roadmap, non-Si materials and non-traditional devices are increasingly being considered for heterogeneous integration on silicon CMOS platforms. High-k metal gates and Ge/III-V high mobility channels are some examples of materials under consideration. In addition, strong interest in low power technologies, coupled with need for increased functional diversity at the chip and system level, has lead to the investigation of devices such as MEMS integrated with CMOS and tunneling FET devices. These trends raise critical process and integration challenges, not only in making dissimilar - sometimes outright incompatible - materials and devices work seamlessly, but also in the characterization and reliability assessment. Industry trends, potential solutions around road blocks, outlook for Moore's law driven scaling vs. More than Moore options, opportunities, and gaps will be discussed.

Visuals of this keynote address