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IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP
Ref. only...2011 CALL FOR PAPERS |
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We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics:
•Designing-in reliability (products, circuits, systems, processes) •Identification and characterization of reliability effects •Deep sub-micron transistor and circuit reliability •Customer product reliability requirements / manufacturer reliability tasks •Root cause defects, physical mechanisms, and simulations •Wafer level reliability tests, test approaches, and reliability test structures:
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Abstract submission: Your two-page extended abstract (maximum two pages including figures) should state clearly and concisely the results of your work and why they are significant. Representative data and figures that support your proposal are REQUIRED. Please e-mail your abstract to the Technical Program Chair either as an MS Word document or .pdf attachment no later than July 16, 2011. Fax submissions will NOT be accepted. A separate cover page must include your full business address, i.e., author name, affiliation, address, telephone and fax numbers, and the e-mail address for each co-author. State whether oral or poster presentation is preferred. All submissions will be acknowledged by email within one week. If you do not receive acknowledgment of your submission, please contact the Technical Program Chair. A final version of the accepted papers is due at the workshop for inclusion in the Final Report published by IEEE. The workshop offers the opportunity for expanded versions of selected workshop presentations to be part of a special IRW Proceedings Issue of the IEEE Transactions in Device and Material Reliability (TDMR). For more information, contact the Technical Program Chair: Andrew Turner, aaturner@us.ibm.com, Tel: 802.769.6140 |
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Late News Papers IIRW is prepared to accept late-news papers until September 9th. Authors of late papers will be notified by September 16th, 2011. You are not required to submit your viewgraphs for inclusion in our IIRW Handout Booklet. If accepted, your final four-page (maximum) manuscript will be included in the 2011IIRW Final Report. Please follow the Oral-author_instructions for your preparation of viewgraphs and final manuscript.
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Author Instructions
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