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• Identification of reliability effects:
failure mechanisms and sensitivities to materials
and manufacturing.
• Reliability models
(existing/new) used to show:
experimental agreement between short-duration and
long-duration test results, limits to accelerated stress, applications for AC, pulsed, and DC conditions.
• Reliability test structures:
design, characterization, uses and data analysis;
integrated on-chip reliability test systems
(including electrical and/or physical test/analysis).
• Wafer level reliability tests and test approaches:
test and analysis methodologies, reduction in development time,
relation to circuit element and package tests, in-line monitors;
use and interpretation of WLR data; success stories;
learning achieved with WLR, the fine tuning of a WLR implementation.
• Designing-in reliability
(circuits, processes, products):
methodologies and concepts, modeling, simulation tools,
reliability-driven design rules and checkers;
use of WLR for design rule verification.
• Customer product reliability
requirements:
reliability evaluation methodologies; data bases;
reporting systems; future reliability targets.
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