IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP
October 18-22, 2009

2009 Group Picture

The final report of the 2009 International Integrated Reliability Workshop represents the final product of the many authors and volunteers who made this meeting a great success. Since it began in 1982 as the Wafer Level Reliability Workshop, the meeting has maintained a character very different from most other scientific and technical meetings. Attendees are encouraged and expected to participate actively in every aspect of the Workshop, to share their own results and insights, to question speakers, to take part in the discussion groups and special interest groups. Since it began, the Workshop has maintained an atmosphere which fosters close interaction among attendees in a setting of great natural beauty with minimal distractions.

We were very fortunate to have a distinguished keynote speaker this year, Dr. John  Schmitz, vice president of Process Technology Research, NXP Semiconductors. His inspiring lecture entitled: “Reliability in the More than Moore Landscape” set the tone of the very productive meeting in the emerging and non-traditional area.

This year, we had an extensive educating tutorial program with 8 tutorials presented by world-class experts.  These tutorials started on Sunday evening and continued through the whole workshop, being interwoven into the technical program. The tutorial topics included: 3D integration and reliability, AFM, ESD, high-k dielectric / metal gate reliability, international fWLR Monitoring guideline, reliability of metallisation, Nanoscale ICs developed by using DNA Origami, and last but not least: NBTI.

For the first time in the IIRW history, we have invited papers in the technical program. The 7 invited presentations together with 22 contributed oral presentations and 20 fully peer reviewed poster presentations as well as several walk in posters form a very strong technical IIRW 2009 program. All the presentations are given in serial, drawing all the attention from all the attendees with very fruitful discussions.

As is always the case, the evenings were fully occupied by poster sessions, discussion groups (DGs) and special interest groups (SIGs). The poster presentations were given on both Monday and Wednesday in the evening. These two evening poster sessions gave the attendees and authors plenty of time to have in-depth discussions with useful feedback. The discussion groups on the topics of fWLR, NBTI, BEOL, Prod/memory reliability addressed various views in the common interest area, and the discussions lasted till late in the evenings.

Helped by the great location and nice weather, the “free program” on Wednesday afternoon generated many Giga-bytes of desktop-background photos, in parallel to the “off line” discussions and networking, yielding an excellent memory of the 2009 IIRW.

Presented to the reader in the final report is the collection of the paper manuscripts, the abstracts of the keynote address, the abstracts of the tutorials, and the summaries of the discussion groups. For the attendees, this workshop has been intellectually stimulating and informative. I hope the final report will do the same for the reader.

Guoqiao Tao
General Chair , IIRW 2009