Reliability Experts Forum
The International Integrated Reliability workshop (IIRW 2018), the IEEE Electron Device Society (EDS) and the Reliability Society (RS) are pleased to announce the inaugural “Reliability Experts Forum” which will be held on Tuesday, October 9th as part of the IIRW 2018 technical program, which is taking place at the Stanford Sierra Conference center, South Lake Tahoe, USA, from October 7th to 11th.
The 1-day event aims to assemble the top reliability experts to discuss the current understanding and the challenges facing the three main transistor reliability mechanisms -- TDDB, BTI and Hot Carrier degradation. The three panel discussions will focus on device physics and the reliability models associated with each mechanism. Each session will be ran by a moderator, and animated by multiple panelists.
More than forty world-renown reliability experts are invited to share their views and enrich the discussion.
Moderator: Jason Campbell (NIST)
Panelists: Tibor Grasser (University of Vienna), Souvik Mahapatra (IIT Bombay), Andreas Kerber, James Stathis (IBM), Jacopo Franco (IMEC)
Hot Carrier panel
Moderator: Stanislas Tyaginov (IUE Vienna)
Panelists: Stephen Ramey (Intel), Stewart Rauch (Globalfoundries RF), Miaomiao Wang (IBM), Luigi Pantisano (Globalfoundries)
Moderator: Luca Larcher (Univerisity of Modena)
Panelists: Ernest Wu (IBM), Joe McPherson (McPherson Reliabiliy Consulting), Tanya Nigam (Globalfoundries), Gennadi Bersuker (The Aerospace Corporation), Chetan Prasd (Intel)
|IIRW 2018 General Chair||Luca Larcher||U. Modena and Reggio Emilia|
|IIRW 2018 Technical Program Chair||Zakariae Chbili||GLOBALFOUNDRIES|
|EDS Device Reliability Physics Committee Chair||Souvik Mahapatra||IIT Bombay|
|EDS Device Reliability Physics Committee member||Stephen Ramey||Intel|
For further information please contact the Technical Program Chair:
Zakariae Chbili, Globalfoundries