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International Integrated Reliability Workshop

The IEEE International Integrated Reliability Workshop (IIRW) originated from the Wafer Level Reliability Workshop in 1982. The IIRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

Tutorials, paper presentations, poster sessions, moderated discussion groups, special interest groups, and the informal format of the technical program provide a unique environment for understanding, developing, and sharing reliability technology and test methodologies for present and future semiconductor applications as well as ample opportunity for open discussions and interactions with colleagues.

Hot reliability topics for the workshop include: SiGe and strained Si, III-V, SOI, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, organic electronics, emerging memory technologies (RRAM etc.) and future "nano"-technologies, NEMS/MEMS, photovoltaics, transistor reliability including hot carriers and NBTI/PBTI, Cu interconnects and low-k dielectrics, product reliability and burn-in strategy, impact of transistor degradation on circuit reliability, reliability modeling and simulation, optoelectronics, single event upsets, as well as the traditional topics of wafer level reliability (WLR) and built-in reliability (BIR).

 

The submission deadline has been extended to July 30th. For a new submission click here

 

IIRW 2018 new features

 

The Inaugural Reliability Experts Forum 2018new 

 

More than forty world-renown reliability experts are invited to share their views and discuss the three main transistor reliability mechanisms -- TDDB, BTI, HC degradation. More information is found here

 

 Best student paper awardnew

 

Student papers, presented by students and based on their research work will be considered for Best student paper award. Click here for more information

 

 

 

 The top 5 papers will be published in IEEE Transaction on Device and Material Reliability (TDMR)

 

The technical program committee will select the best five papers for publication in a special issue of IEEE Transaction on Device and Material Reliability (TDMR). Click here for more information

 

 

Luca Larcher
Univ. Modena and Reggio Emilia

General Chair

Zakariae Chbili
GLOBALFOUNDRIES

Technical Program Chair

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