5-9 October 2025
Stanford Sierra Conference Center
South Lake Tahoe, CA, USA
Welcome to IIRW
The IEEE International Integrated Reliability Workshop (IIRW) originated from the Wafer Level Reliability Workshop in 1982. The IIRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.
Tutorials, paper presentations, poster sessions, moderated discussion groups, special interest groups, and the informal format of the technical program provide a unique environment for understanding, developing, and sharing reliability technology and test methodologies for present and future semiconductor applications as well as ample opportunity for open discussions and interactions with colleagues.
IIRW 2023 Best student paper
"The Major Effect of Trapped Charge on Dielectric Breakdown Dynamics and Lifetime Estimation"
Sara Vecchi, University of Modena and Reggio Emilia
Important Dates
Regular Abstract Deadline:
June 15, 2025
Author Notification:
July 27, 2025
Early Registration Deadline:
September 20, 2025
Late News Deadline:
September 14, 2025
Contacts
General Chair:
Cristian Zambelli
Technical Program Chair:
Jean Yang-Scharlotta
News
IIRW 2025 date announced! 5-9 October 2025
Call For Papers
![](https://www.google.com/images/icons/product/drive-32.png)
Scope
IIRW 2024 welcomes abstracts on, but not limited to, these topics:
In-memory computing and neuromorphic reliability
Plasma-induced damage (PID), electrostatic discharge (ESD), Failure analysis
FEOL/MOL/BEOL dielectrics (high-k, SiO2, SiON, low-k)
FET, FinFET, SOI, III-V, SiGe reliability (HCI, BTI, TDDB, RTN, etc.)
Conventional and emerging memories (Flash, RRAM, Ferroelectrics, etc.)
Emerging technologies and devices (2D materials, IGZO, etc.)
Power, wide-bandgap (SiC, GaN, etc.) devices and circuits reliability
RF and mm/sub-mm Wave devices and circuits reliability
Modeling and simulation for reliability, including self-heating
Process integration and advanced packaging reliability
Design-in-reliability (products, circuits, systems, processes)
Reliability of advanced automotive circuits, systems, products
Customer/manufacturer product reliability requirements
Wafer-level reliability tests for monitoring and qualification