5-9 October 2025

Stanford Sierra Conference Center

South Lake Tahoe, CA, USA



Welcome to IIRW

The IEEE International Integrated Reliability Workshop (IIRW) originated from the Wafer Level Reliability Workshop in 1982. The IIRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.

Tutorials, paper presentations, poster sessions, moderated discussion groups, special interest groups, and the informal format of the technical program provide a unique environment for understanding, developing, and sharing reliability technology and test methodologies for present and future semiconductor applications as well as ample opportunity for open discussions and interactions with colleagues.

IIRW 2023 Best student paper

"The Major Effect of Trapped Charge on Dielectric Breakdown Dynamics and Lifetime Estimation"

 Sara Vecchi, University of Modena and Reggio Emilia 

Important Dates

Regular Abstract Deadline:

June 15, 2025

Author Notification:

July 27, 2025

Early Registration Deadline:

September 20, 2025

Late News Deadline: 

September 14, 2025

Contacts

General Chair: 

Cristian Zambelli  

gc.iirw@gmail.com

Technical Program Chair:

Jean Yang-Scharlotta 

tpc.iirw@gmail.com

News

Call For Papers

IIRW2025-CfP.pdf

Scope

IIRW 2024 welcomes abstracts on, but not limited to, these topics:

Sponsors