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Welcome to IIRW
Welcome to IIRW
The IEEE International Integrated Reliability Workshop (IIRW) originated from the Wafer Level Reliability Workshop in 1982. The IIRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.
Tutorials, paper presentations, poster sessions, moderated discussion groups, special interest groups, and the informal format of the technical program provide a unique environment for understanding, developing, and sharing reliability technology and test methodologies for present and future semiconductor applications as well as ample opportunity for open discussions and interactions with colleagues.
IIRW 2024 Best student paper
"First write pulse-induced interface damage in ferroelectric field-effect transistors," Priyankka Gundlapudi Ravikumar, Georgia Institute Of Technology
News
News
Abstract submission deadline extended to July 7! Submit your abstract here.
Abstract submissions now open!
IIRW 2025 date announced! 5-9 October 2025
Important Dates
Important Dates
Regular Abstract Deadline:
June 15, 2025
July 7, 2025
Author Notification:
July 27, 2025
Early Registration Deadline:
September 20, 2025
Late News Deadline:
September 14, 2025
Contacts
Contacts
General Chair:
Cristian Zambelli
Technical Program Chair:
Jean Yang-Scharlotta
IIRW2025-CfP-v0.3.pdfScope
Scope
IIRW 2025 welcomes abstracts on, but not limited to, these topics:
Key focus area: Advanced nodes reliability
Key focus area: Silicon photonics reliability
Key focus area: Extreme environments (Cryo./Rad.) reliability
In-memory computing and neuromorphic reliability
Plasma-induced damage (PID), electrostatic discharge (ESD), Failure analysis
FEOL/MOL/BEOL dielectrics (high-k, SiO2, SiON, low-k)
FET, FinFET, SOI, III-V, SiGe reliability (HCI, BTI, TDDB, RTN, etc.)
RF and mm/sub-mm Wave devices and circuits reliability
Modeling and simulation for reliability, including self-heating
Process integration and advanced packaging reliability
Design-in-reliability (products, circuits, systems, processes)
Reliability of advanced automotive circuits, systems, products
Customer/manufacturer product reliability requirements
Wafer-level reliability tests for monitoring and qualification
Conventional and emerging memories (Flash, RRAM, Ferroelectrics, etc.)
Emerging technologies and devices (2D materials, IGZO, etc.)
Power, wide-bandgap (SiC, GaN, etc.) devices and circuits reliability
Sponsors
Sponsors
Google Sites
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