9-13 October 2022
Stanford Sierra Conference Center
Fallen Leaf Lake, CA, USA
Welcome to IIRW
The IEEE International Integrated Reliability Workshop (IIRW) originated from the Wafer Level Reliability Workshop in 1982. The IIRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems.
Tutorials, paper presentations, poster sessions, moderated discussion groups, special interest groups, and the informal format of the technical program provide a unique environment for understanding, developing, and sharing reliability technology and test methodologies for present and future semiconductor applications as well as ample opportunity for open discussions and interactions with colleagues.
IIRW 2021 Best student paper
"Understanding the Reliability of Ferroelectric Tunnel Junction Operations using an Advanced Small-Signal Model" by Lorenzo Benatti
Important Dates
Regular Abstract Deadline: August 1, 2022
Author Notification: August 31, 2022
Late News Deadline: September 10, 2022
Contacts
General Chair: Matthew Hogan gc.iirw@gmail.com
Technical Program Chair: Francesco Maria Puglisi tpc.iirw@gmail.com
Call For Papers

Technical Program

PID Questionnaire

Scope
The IIRW technical program and management committee invites abstracts related to the many areas of semiconductor reliability, such as:
FOCUS AREA: Circuit reliability, device-circuit degradation, aging
FOCUS AREA: In-memory computing and neuromorphic reliability
FOCUS AREA: Plasma-induced damage, electrostatic discharge
FEOL/MOL/BEOL dielectrics (high-k, SiO 2 , SiON, low-k)
FET, FinFET, SOI, III-V, SiGe reliability (HC, BTI, TDDB, RTN, etc.)
Conventional and emerging memories (Flash, RRAM, etc.)
Emerging technologies and devices (2D materials, IGZO, etc.)
Power, wide-bandgap (SiC, GaN, etc.) devices reliability and circuits reliability
RF and mm/sub-mm Wave devices reliability and circuits reliability
Modeling and simulation of reliability, including self-heating
Process integration reliability
Failure analysis and advanced packaging reliability
Impact of devices degradation on circuit reliability
Design-in-reliability (products, circuits, systems, processes)
Advanced automotive circuits, systems, products reliability
Customer/manufacturer product reliability requirements
Wafer-level reliability tests for monitoring and qualification