Committees
Management Committee
Technical Program Chair
Matthew Hogan, Siemens Digital Industries Software, United States
Reliability Experts Forum Chair
Suresh Uppal, Maxim Integrated Products Inc, United States
Publication Chair
Mark Anders, National Institute of Standards and Technology, United States
Tutorial Co-Chair/Vice Technical Program Chair
Francesco Maria Puglisi, Università di Modena e Reggio Emilia, Italy
Asian Liaison
Nagarajan Raghavan, Singapore University of Technology and Design, Singapore
Technical Program Committee
Adrian Chasin, imec, Belgium
Alexander Makarov, Technische Universität Wien, Austria
Ananth Narayanan, Phononic Inc, United States
Andrea Padovani, Università di Modena e Reggio Emilia, Italy
Andreas Aal, Volkswagen AG, Germany
Andreas Kerber, ON Semiconductor, United States
Andrew Kim, Intel Corporation, United States
Brad Bittel, Intel Corporation, United States
Chadwin Young, University of Texas at Dallas, United States
Charles LaRow, Intel Corporation, United States
Christian Schlünder, Infineon Technologies AG, Germany
Cristian Zambelli, University of Ferrara, Italy
Eswar Ramanathan, Globalfoundries, United States
Francesco Maria Puglisi, Università di Modena e Reggio Emilia, Italy
Gaddi Haase, Sandia National Laboratories, United States
James Lloyd, SUNY Polytechnic Institute, United States
Jason Campbell, National Institute of Standards and Technology, United States
Jason Ryan, National Institute of Standards and Technology, United States
Jean-Yean Scharlotta, NASA, United States
Jim Ashton, National Institute of Standards and Technology, United States
Lado Filipovic, Technische Universität Wien, Austria
Luca Larcher, Università di Modena e Reggio Emilia, Italy
Mario Lanza, Soochow University, China
Mark Anders, National Institute of Standards and Technology, United States
Matthew Hogan, Siemens Digital Industries Software, United States
Matthew Ring, ON Semiconductor, United States
Michael Waltl, Technische Universität Wien, Austria
Nagarajan Raghavan, Singapore University of Technology and Design, Singapore
Partha Chakraborty, CFD Research Corporation, United States
Patrick Lenahan, Penn State University, United States
Pavel Bolshakov, Intel Corporation, United States
Peter Paliwoda, GlobalFoundries Inc, United States
Pragya Shrestha, National Institute of Standards and Technology, United States
Qanit Takmeel, ASM, United States
Saitej Ravi, Intel Corporation, United States
Stanislav Tyaginov, imec, Belgium
Susanna Reggiani, Università di Bologna, Italy
Thomas Kauerauf, Globalfoundries Inc, United States
Tom Kopley, United States
Umberto Celano, imec, Belgium
Zakariae Chbili, Intel Corporation, United States