Committees

Management Committee

General Chair

Matthew Hogan, Siemens Digital Industries Software, United States

gc.iirw@gmail.com

Technical Program Chair

Francesco Maria Puglisi, Università di Modena e Reggio Emilia, Italy

tpc.iirw@gmail.com

Reliability Experts Forum Chair/Vice Technical Program Chair

Suresh Uppal, Rivos Inc, United States

ref.iirw@gmail.com

Finances Chair

Charles LaRow, Intel Corporation, United States

fin.iirw@gmail.com

Publication Chair

Mark Anders, Broadcom, United States

publish.iirw@gmail.com

Arrangement Chair

Brad Bittel, Intel Corporation, United States

arr.iirw@gmail.com

Registration Chair

Jim Ashton, Keysight, United States

register.iirw@gmail.com

Communication Chair

Ashton Purcell, Penn State University, United States

comms.iirw@gmail.com

Discussion Group Chair

Alexander Grill, imec, Belgium

alexander.grill@imec.be

Tutorial Chair

Michael Waltl, Technische Universität Wien, Austria

waltl@iue.tuwien.ac.at

Poster Co-Chair

Cristian Zambelli, University of Ferrara, Italy

cristian.zambelli@unife.it

Poster Co-Chair

Gaddi Haase, Sandia National Laboratories, United States

gshaase@sandia.gov

Audio/Visual Chair

Lado Filipovic, Technische Universität Wien, Austria

filipovic@iue.tuwien.ac.at

European Liaison

Andreas Aal, Volkswagen AG, Germany

andreas.aal@volkswagen.de

Asian Liaison

Nagarajan Raghavan, Singapore University of Technology and Design, Singapore

nagarajan@sutd.edu.sg

China Liaison

Fei Hui, Technion, Israel

fei.hui@campus.technion.ac.il

IT Chair

Alexander Makarov, imec, Belgium

it.iirw@gmail.com

Technical Program Committee

Adrian Chasin, imec, Belgium

Alexander Makarov, imec, Belgium

Ananth Narayanan, Phononic Inc, United States

Andrea Padovani, Università di Modena e Reggio Emilia, Italy

Andreas Aal, Volkswagen AG, Germany

Andreas Kerber, onsemi, United States

Andrew Kim, Intel Corporation, United States

Brad Bittel, Intel Corporation, United States

Chadwin Young, University of Texas at Dallas, United States

Charles LaRow, Intel Corporation, United States

Christian Schlünder, Infineon Technologies AG, Germany

Cristian Zambelli, University of Ferrara, Italy

Eswar Ramanathan, Globalfoundries, United States

Francesco Maria Puglisi, Università di Modena e Reggio Emilia, Italy

Gaddi Haase, Sandia National Laboratories, United States

James Lloyd, SUNY Polytechnic Institute, United States

Jason Campbell, National Institute of Standards and Technology, United States

Jason Ryan, National Institute of Standards and Technology, United States

Jean-Yean Scharlotta, NASA, United States

Jifa Hao, Google, United States

Jim Ashton, Keysight, United States

Lado Filipovic, Technische Universität Wien, Austria

Luca Larcher, Applied Materials, Italy

Mario Lanza, Soochow University, China

Mark Anders, National Institute of Standards and Technology, United States

Matthew Hogan, Siemens Digital Industries Software, United States

Matthew Ring, onsemi, United States

Michael Waltl, Technische Universität Wien, Austria

Nagarajan Raghavan, Singapore University of Technology and Design, Singapore

Partha Chakraborty, CFD Research Corporation, United States

Patrick Lenahan, Penn State University, United States

Pavel Bolshakov, Intel Corporation, United States

Peter Paliwoda, GlobalFoundries Inc, United States

Pragya Shrestha, National Institute of Standards and Technology, United States

Qanit Takmeel, ASM, United States

Saitej Ravi, Intel Corporation, United States

Stanislav Tyaginov, imec, Belgium

Susanna Reggiani, Università di Bologna, Italy

Thomas Kauerauf, Globalfoundries Inc, United States

Tom Kopley, United States

Tommaso Zanotti, Università di Modena e Reggio Emilia, Italy

Umberto Celano, imec, Belgium

Zakariae Chbili, Intel Corporation, United States