Keynote Speaker
Reliability Challenges & Opportunities in the AI era
Dr. Sangwoo Pae, Samsung Electronics
Biography: Sangwoo Pae received a Ph.D. in Electrical and Computer Engineering from Purdue University and worked at Intel for 13 years, followed by another 13 years at Samsung Electronics. Most recently, Sangwoo was head of Q&R, EVP for Samsung Memory business while being concurrently responsible for leading the overall Quality Synergy Project TF across Samsung DS (Device Solutions), greatly contributing to customer quality improvement and semiconductor quality process enhancements. Before working in Memory, as Q&R head & team leader, he oversaw logic process development and product quality at Samsung SLSI and Foundry, playing a key role in the successful launch of major customers' products. Some of them includes the development and qualification of 14nm and 10/8nm FinFET technologies for the mobile, HPC and Auto. At Intel, Sangwoo made significant contributions to the development of the world's first 45nm High-k Metal Gate (HKMG) process and products, while serving as a Q&R (Quality and Reliability) Program Manager then. Sangwoo has published over 120 papers and holds more than 60 patents granted and pending. He has also served on technical committees for conferences such as IRPS and IEDM. He is IEEE Sr. Member since 2008.
Dr. Sangwoo Pae
Samsung Electronics
Invited Speakers
Prof. Souvik Mahapatra
IIT Bombay
An Universal Model for CMOS Logic (BTI, SILC/TDDB, HCD) and NAND Flash Memory (P/E Cycling, DR Loss) Reliability
Reliability is a key consideration for CMOS logic and NAND flash memory devices. Logic reliability can be classified as aging - where device parameters gradually shift over time or breakdown. Bias Temperature Instability (BTI), Stress Induced Leakage Current (SILC) and Hot Carrier Degradation (HCD) are manifestations of the former, while Time Dependent Dielectric Breakdown (TDDB) is the manifestation of the latter effect. NAND flash reliability primarily concerns charge loss from a programmed level (data retention (DR) loss), which gets accelerated after repeated program/erase (P/E) cycling. In this talk, we will discuss about a generic framework of trap generation / passivation and trapping / detrapping, and tie up the seemingly diverse set of experiments by an universal underlying theory. Validation of the theory will be showcased against an extensive set of measurement data.
Biography
Souvik Mahapatra is a professor of electrical engineering at Indian Institute of Technology (IIT) Bombay, Mumbai, India. He works in the area of CMOS logic device / circuit and NAND flash memory reliability, and has close collaborations with several semiconductor industries in the IDM, fab, fabless, fab-tool and EDA space. He has published more than 200 articles in peer reviewed journals and conferences, and 22 book chapters, and has delivered invited talks and tutorials at several major international conferences. He is a fellow of IEEE and several Indian science and engineering academies (INSA, INAE and IASc). His work got recognition with a named model (Mahapatra Reliability Model) that is available in Sentaurus Device simulator from Synopsys, and is being used by the semiconductor industry.
Prof. Mario Lanza
National University of Singapore
The Neuro-Synaptic Random Access Memory (NS-RAM)
Electronic neurons and synapses are the two fundamental building blocks of next-generation artificial neural networks. Unlike
traditional computers, these systems process and store data in the same place, eliminating the need to waste time and energy
transferring data from memory to the processing unit (CPU). The problem is that implementing electronic neurons and synapses
with traditional silicon transistors requires interconnecting multiple devices—specifically, about 18 transistors per neuron and 6
per synapse. This makes them significantly larger and more expensive than a single transistor. In this talk, I will present an
ingenious way to reproduce the electronic behaviors characteristic of neurons and synapses in a single conventional silicon transistor. This discovery is revolutionary because it allows the size of electronic neurons to be reduced by a factor of 18 and that of synapses by a factor of 6. Furthermore, I will present a versatile 2-ransistors that allows switching between operating modes (neuron or synapse), without the need to dope the silicon to achieve specific substrate resistance values.
Biography
Prof. Mario Lanza is an Associate Professor of Materials Science and Engineering at the National University of Singapore, since August 2024. He got the PhD in Electronic Engineering in 2010 at the Autonomous University of Barcelona, where he won the extraordinary PhD prize. In 2010-2011 he was NSFC postdoctoral fellow at Peking University, and in 2012-2013 he was Marie Curie postdoctoral fellow at Stanford University. On September 2013 he joined Soochow University (in China), where he promoted until the rank of Full Professor. Between October 2020 and July 2024 he was full-time Associate Professor at the King Abdullah University of Science and Technology (in Saudi Arabia), where he became known for his work in the field of nano-electronics. He has published over 200 research articles in top journals like Nature, Science and Nature Electronics, many of them becoming highly cited. He has been plenary, keynote, tutorial and invited speaker in over 150 conferences, and he and his students have received some of the most prestigious awards in the world (like the IEEE Fellow). He has been often consulted by leading semiconductor companies and publishers. He is an active member of the board governors of the IEEE – Electron Devices Society, and has been involved in the technical and management committee of top conferences in the field of electron devices, including IEDM, IRPS and IPFA.
Prof. Shinichi Takagi
Teikyo University
Degradation mechanisms and mitigation strategies of Hafnia-based ferroelectric device reliability
Since the discovery of ferroelectricity in HfO2-based dielectric films in 2011, ferroelectric devices using HfO2-based thin films as dielectrics have attracted strong interest. Thus, active research and developments on Si-friendly HfO2-based ferroelectric FeRAMs and FeFETs have been conducted for memory, logic and AI applications with extremely low power consumption because of the versatile properties. However, one of the strongest concerns of these ferroelectric devices is reliability. This paper introduces our recent studies on degradation mechanisms and mitigation strategies of FeRAM and FeFET reliability. For metal/ferroelectric/metal (MFM) capacitors, we discuss critical reliability issues for FeRAM applications, such as oxide breakdown, wakeup and fatigue with an emphasis on film thickness scaling. Also, for metal/ferroelectric/semiconductor (MFIS) gate stacks, we examine the complicated interaction and coupling between polarization charges, trapped charges and inversion-layer charges. Based on this knowledge, the mechanisms of memory window narrowing and read disturb of FeFETs are discussed and the mitigation technologies are addressed.
Biography
Shinichi Takagi received B.S., M.S., and Ph.D. degrees in electronic engineering from the University of Tokyo, Japan, in 1982, 1984, and 1987, respectively. He joined the Toshiba Research and Development Center, Japan, in 1987, where he was engaged in research on the device physics of Si MOSFETs. From 1993 to 1995, he was a Visiting Scholar at Stanford University, where he studied Si/SiGe hetero-structure devices. In October 2003, he moved to the University of Tokyo, where he worked as a professor in the Department of Electrical Engineering and Information Systems for 23 years. He has currently been working as a specially appointed professor in Advanced Comprehensive Research Organization, Teikyo University, Tokyo, Japan, since April 2025. His recent interests include the science and technologies of advanced CMOS, HfO2-based ferroelectric devices, and cryo-CMOS.
Prof. Ivan Sanchez Esqueda
Arizona State University
Investigating cryogenic behavior in irradiated FDSOI transistors: Impact of trap buildup on charge transport and electrostatic effects
In this talk I will discuss recent experiments that establish the effects of ionizing radiation on the operation of FDSOI field-effect transistors (FETs) down to cryogenic temperatures. The results elucidate the detrimental impact of total ionizing dose (TID) damage on electrostatic performance via parametric shifts in threshold voltage and subthreshold-swing, as well as on transport behavior resulting from charged-impurity scattering and its effect on field-effect mobility. The analysis is supported by theoretical modeling of quasi-ballistic devices based on Landauer transport theory relevant to the nanoscale geometries of test structures used in this study.
Biography
Ivan Sanchez Esqueda is an assistant professor of electrical engineering at Arizona State University. His research focuses on semiconductor physics, nanotechnology, and nanoelectronics. His research contributions include the development of logic, memory, and neuromorphic devices using emerging low-dimensional materials. He has also developed device concepts for CMOS and beyond-CMOS applications and contributed to theoretical modeling/analysis of nanoscale transistors including extreme environments (cryogenic, radiation, reliability). Prof. Sanchez Esqueda is a senior member of the IEEE and serves as Associate Editor for the IEEE Transactions on Electron Devices.
Dr. Artemisia Tsiara
imec
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Biography
Artemisia Tsiara received her B.Sc. degree in Physics at the University of Ioannina, Greece in 2011, and her M.Sc. degree in Electrical, Electronics and Communications Engineering from Aristotle University of Thessaloniki, Thessaloniki, Greece, in 2015. In 2019, she obtained her Ph.D. degree from Université Grenoble Alpes, Grenoble, France, working in CEA-Leti on the Reliability characterization of nanowire transistors. From 2018 to 2024, she worked as a Reliability researcher on Silicon Photonics with the reliability group of imec, Leuven, focusing on exploratory & established components such as Photodetectors, Modulators, and Lasers based on Si, Ge, and III-V materials. Currently, she is in the PMO team of IC-Link as an R&D Project Leader for Silicon Photonics, supporting different bilateral customers leveraging imec's technology towards their product targets.
Dr. Mikaël Cassé
CEA-LETI
Thermal Effects in FDSOI Transistors at Cryogenic Temperatures
Cryogenic CMOS circuits have regained interest with the growing research toward a scalable, fault-tolerant quantum computing system. Among Si-CMOS technologies, FD-SOI ensures performance with lower power consumption at cryogenic temperatures, typically well below 100K, offering threshold voltage tunability, as well as compatibility with Si spin qubits. However, thermal effects can hinder performance gains. The low thermal conductivity of some materials at low temperature can cause severe local temperature increase, i.e. high self-heating effect, affecting the electrical performance of the device itself and its neighborhood, as well as the circuit. This work addresses thermal effects in FD-SOI transistors down to 4K, presenting experimental results on thermal resistance, spatial thermal effects, discussing their impact on performance and reliability.
Biography
Dr. Mikael Cassé received the Ph.D. degree in physics from the Institut National des Sciences Appliquées, Toulouse, France, in 2001. He studied quantum effects at low temperature in semiconductor systems. Since 2001, he is working as a Research Staff Member at CEA-Leti, Grenoble. His current research interests include DC / RF electrical characterization and modelling of advanced CMOS devices, cryoCMOS, novel CMOS device architectures and devices for quantum computing. He has been involved in several EU and French projects. He authored and co-authored more than 200 international communications in peer-reviewed journals and conference proceedings, and two book chapters.
Dr. Preeti Chauhan
Beyond Performance: Navigating Hardware Reliability Challenges in LLM Infrastructure
Large Language Models (LLMs) represent a significant leap in AI capabilities, yet their deployment is increasingly challenged by the reliability of the specialized hardware used for acceleration. AI training workloads demand unprecedented computational power, vast memory capacity, and robust interconnects. This talk will delve into the reliability challenges inherent in this critical hardware infrastructure. We will discuss issues pertaining to the field reliability and consistent performance of specialized AI accelerators, the integrity of memory systems, and the resilience of interconnects, all of which are becoming paramount for the stable and cost-effective operation of LLM solutions. Ensuring hardware reliability is not just an operational concern, but an escalating critical challenge for the future of scalable AI.
Biography
Dr. Preeti Chauhan is a Technical Program Manager (TPM) at Google, leading strategic and transformational initiatives in AI/ML hardware within the Data Center Quality and Reliability group. She leverages her expertise to drive improvements in data center quality, reliability, and deployment speed at Google's massive scale. Her extensive experience encompasses quality and reliability leadership for cutting-edge technologies like Intel's Foveros 3D packaging and server microprocessors. Actively engaged within the engineering community, she serves as a senior member of the Institute of Electrical and Electronics Engineers (IEEE) and co-edits the data column in the prestigious Computer magazine. Dr. Chauhan is currently serving as the 2025 Vice President for Meetings and Conferences within the IEEE Reliability Society and as a liaison to the IRPS Board of Directors.
Prof. Arka Majumdar
University of Washington
NEO-PGA: Nonvolatile Electro-Optically Programmable Gate Array
Large-scale, electronically reconfigurable photonic integrated circuits (PICs) can enable programmable gate array (PGA) to realize extremely fast, arbitrary linear operations, with potential applications in classical and quantum optical information technology. The basic
building blocks of existing PGAs are thermally tunable broadband Mach-Zehnder-Interferometers, which pose several limitations in terms of size, power, and scalability. Chalcogenide-based phase change materials (PCMs), exhibiting large nonvolatile change in the refractive index, can potentially transform these devices, providing at least one order of magnitude reduction in the device size, zero static energy consumption, and minimal cross-talk. In this talk, I will discuss different PCMs that can be used in conjunction with silicon and silicon nitride photonics, to create reconfigurable optical switches for visible and infrared wavelengths. I will also talk about different heaters that are needed to actuate the phase transitions on-chip. Specifically, I will show how using ultrathin graphene as a heater element can provide very high energy-efficiency, close to the fundamental limit set by thermodynamics.
Biography
Prof. Arka Majumdar is a professor in the departments of Electrical and Computer Engineering and Physics at the University of Washington (UW). He is also a visiting scientist in Meta Reality Labs (2025-current). He received B. Tech. from IIT-Kharagpur (2007), where he was honored with the President’s Gold Medal. He completed his MS (2009) and Ph.D. (2012) in Electrical Engineering at Stanford University. He spent one year at the University of California, Berkeley (2012-13), and then in Intel Labs (2013-14) as postdoc before joining UW. His research interests include developing a hybrid nanophotonic platform using emerging material systems for optical information science, imaging, and microscopy. Prof. Majumdar is the recipient of multiple Young Investigator Awards from the AFOSR (2015), NSF (2019), ONR (2020) and DARPA (2021), Intel early career faculty award (2015), Amazon Catalyst Award (2016), Alfred P. Sloan fellowship (2018), UW college of engineering outstanding junior faculty award (2020), iCANX Young Scientist Award (2021), IIT-Kharagpur Young Alumni Achiever Award (2022), DARPA Director’s Award (2023), and Rising star of light award (2023). He is an Optica (2024) and SPIE (2025) fellow. He is co-founder and technical advisor of Tunoptix, a startup commercializing software defined meta-optics.
Tutorial Speakers
Dr. Fabia Farlin Athena
Stanford University
Reliability of Oxide Semiconductor Technology for Gain-Cell Embedded DRAM Applications
Oxide semiconductor (OS) technology offers significant potential for monolithic 3D integration of low-leakage, high-density embedded DRAM (eDRAM). OS FETs (such as IGZO, ITO, IWO, IO) exhibit ultra-low leakage, enabling capacitor-less DRAM cells to achieve retention times orders of magnitude longer than conventional DRAM or SRAM. However, these devices experience reliability challenges such as positive bias-temperature instability (PBTI), causing threshold voltage shifts over time. In this tutorial, I will present the reliability landscape of OS technology for two-transistor (2T) gain-cell eDRAM applications. Two primary mechanisms have been identified for PBTI: deep electron trapping and hydrogen-related defect formation. At lower temperatures under positive bias stress, electron trapping in the amorphous channel dominates. At elevated temperatures (e.g., 85 °C), hydrogen release becomes significant, creating oxygen-vacancy donors and leading to negative shifts in threshold voltage (VT), which compromise memory cell retention. Building on this understanding, I will show how optimizing the gate dielectric enhances BTI stability at high temperatures. By introducing tailored dielectric stacks, the critical temperature at which hydrogen release overtakes electron trapping can be effectively tuned, minimizing net VT shifts under stress. I will also discuss interface-dipole (ID) engineering as an independent control knob for OSFET VT, inspired from the dipole technique in silicon high-κ/metal-gate techniques . For example, inserting a positive dipole-forming oxide layer at the interface between HfO2 and OS channel can raise the VT of IWO FETs by approximately 0.45–0.50 V compared to a baseline stack. This offset remains stable from 85 °C down to cryogenic temperatures (-263.15 °C). Importantly, ID-engineered FETs demonstrate excellent reliability, exhibiting minimal VT shifts (~60 mV) under worst-case DC stress at 85 °C compared to ~300 mV for baseline devices. This orthogonal VT tuning approach has been validated across a wide variety of OS channels for instance IWO, IO, ITO, IGZO, significantly reducing leakage. Simulations indicate a reduction in refresh energy by approximately 10,000× with increased VT. Additionally, I will introduce a complementary n-p gain-cell memory, combining a p-type oxide FET (collaboration with TSMC) with an n-type oxide FET, mitigating capacitive coupling and ensuring reliable long retention. This tutorial will cover fundamentals of BTI phenomena and modeling in OS transistors, memory cell design innovations, and future outlooks. Attendees will gain insights into BTI fundamentals, recent advancements, and ongoing challenges in the practical implementation of OS gain-cell memories.
Biography
Fabia Farlin Athena is an Energy Fellow in Electrical Engineering at Stanford University, working with Prof. H.-S. Philip Wong and Prof. Alberto Salleo to develop high-bandwidth oxide-semiconductor gain-cell memories and monolithic 3-D memory/logic stacks for ultra-low-power AI systems. She earned her Ph.D. and M.S. in Electrical & Computer Engineering from Georgia Institute of Technology, advised by Prof. Eric M. Vogel, where her research focused on adaptive oxide memristors for brain-inspired AI, receiving the Sigma Xi Best Ph.D. Thesis Award. She has also held research scientist intern positions at IBM TJ Watson. Fabia’s interdisciplinary contributions have been recognized with the IBM PhD Fellowship, MRS Graduate Student Award, Cadence Technology Scholarship, VLSI Symposium Highlight Paper Award, EECS Rising Stars, Stanford Energy Postdoctoral Fellowship, and Forbes 30 Under 30 North America.
Dr. Hiroshi Oka
National Institute of Advanced Industrial Science and Technology (AIST)
Overview and Perspective of Cryo-CMOS Devices Toward Scalable Quantum Computers
Quantum computers have attracted significant attention due to their faster computation capability compared with classical computers for some complex problems. Currently, the control/readout electronics for solid-state qubits, such as superconducting and Si spin qubits, are placed outside the dilution refrigerator, and the bulky control/readout electronics and qubits are connected by substantial numbers of electrical interconnects. With this configuration, the number of interconnects increases exponentially as increasing qubits, which is not a realistic way to scale up qubits. To overcome this bottleneck, cryogenic-CMOS (cryo-CMOS) technology has been studied intensively in recent years, which is assumed to operate inside the dilution refrigerator at a few Kelvins or less. In this tutorial, I will provide an overview of cryo-CMOS technology with a particular focus on device physics that differs significantly from conventional room temperature operation.
Biography
Hiroshi Oka received the M.S. and Ph.D. degrees from the Division of Advanced Science and Biotechnology, Osaka University, in 2015 and 2018, respectively. He is currently a Senior Researcher with the Semiconductor Frontier Research Center, National Institute of Advanced Industrial Science and Technology (AIST), Japan. His research interests include the cryogenic CMOS, Si spin qubits, and Ge-based high-mobility CMOS.
Dr. SangHoon Shin
Hanyang University ERICA
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Biography
SangHoon Shin (Member, IEEE) received the B.S. degree from Hanyang University, the M.S. degree from the University of Tokyo, and the Ph.D. degree in electrical and computer engineering from Purdue University. He is currently an Assistant Professor at Hanyang University ERICA, where he leads the Advanced Reliable Component Lab. His research interests include advanced semiconductor packaging, heterogeneous integration, and device reliability, with emphasis on 2.5D/3D integration, FEOL/BEOL/package-level reliability, and logic-memory co-packaging for AI and automotive systems. Before joining academia, he held R&D positions at Tesla, Apple, Intel, and IBM. At Tesla, he led the development and qualification of AI SoC packages for autonomous vehicles using 2.5D/3D CoWoS technologies. At Apple, he focused on reliability engineering for Apple Silicon (M1)–based Mac systems. His earlier roles at Intel and IBM involved CMOS device reliability and neuromorphic device research. Dr. Shin has authored over 40 peer-reviewed publications, including four first-author papers at the IEEE International Electron Devices Meeting (IEDM) and two at the IEEE International Reliability Physics Symposium (IRPS). His work spans topics such as nanoscale transistor self-heating, BTI recovery modeling, and advanced package reliability.